{"id":3975,"date":"2016-01-18T12:01:33","date_gmt":"2016-01-18T12:01:33","guid":{"rendered":"http:\/\/www.solidapps.co.uk\/blog\/?p=3975"},"modified":"2016-01-18T12:01:33","modified_gmt":"2016-01-18T12:01:33","slug":"solidworks-support-monthly-news-january-2016","status":"publish","type":"post","link":"https:\/\/www.solidapps.co.uk\/blog\/2016\/01\/solidworks-support-monthly-news-january-2016\/","title":{"rendered":"SOLIDWORKS Support Monthly News \u2013 January 2016"},"content":{"rendered":"

Welcome to this new edition of the SOLIDWORKS Support Monthly News, coauthored by members of the SOLIDWORKS Technical Support teams worldwide.<\/p>\n

Vote for the best SOLIDWORKS enhancement ideas!<\/h1>\n

577 enhancements ideas are available for voting in the SOLIDWORKS World Top Ten List<\/a>. You\u2019re bound to fin many you\u2019ll adhere to. So vote for them to show your support.<\/p>\n

Remember the voting rules:<\/p>\n

    \n
  1. Any user with an active SOLIDWORKS Customer Portal login can vote. If you have only one seat of SOLIDWORKS but more than one registered user, all can vote<\/li>\n
  2. Go to this forum <\/a> and log in to vote<\/li>\n
  3. You can vote for as many ideas as you want (not just those you proposed) \u2013 no limit<\/li>\n
  4. You can vote an idea up (+1) or down (-1)<\/li>\n
  5. You have until January 22nd, 2016 to vote<\/li>\n<\/ol>\n

    The Top Ten List will be revealed during the SOLIDWORKS World 2016 in Dallas.<\/p>\n

    We look forward to seeing your ideas and hope to see you there.<\/p>\n\n\n\n
    Summary:<\/b>
    \nToday until January 22nd<\/strong>: Voting\u00a0Wednesday February 3rd<\/strong>: Top Ten List revealed<\/td>\n    		\"SWW<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

     <\/p>\n

    Thermal Bottlenecks and Shortcuts in SOLIDWORKS Flow Simulation 2016<\/h1>\n

    With contributions from Joe Galliera
    \n<\/em><\/p>\n

    SOLIDWORKS Flow Simulation 2016 introduces a couple of new thermal parameter results that are actually quite new to thermal analysis. Yes, you read that correctly, new to Thermal analysis\u2026 the whole field! \"Smiling<\/p>\n

    What are they? The Bottleneck (Bn) number and the Shortcut (Sc) number. For this breakthrough, there is actually a US Patent Pending <\/a>for Mentor Graphics and the inventors: Robin Bornoff, John Parry, Byron Blackmore and Alan Davies.<\/p>\n

    The Bottleneck and Shortcut numbers are used primarily in electronics systems and other thermal systems.<\/p>\n

    The Bottleneck (Bn) number<\/h3>\n

    In a blog post, Robin Bornoff<\/a> writes: \u201c \u2018Thermal bottleneck\u2019 [is] a well recognized phrase playing on a very obvious analogy. Despite this there were few attempts to quantify such a parameter. Spurred on by its relevance in electronic thermal design, we did just that, put hard numbers to the concept.\u201d<\/p>\n

    The Bottleneck number identifies flow paths that carry high heat, while at the same time resist the flow of that heat. Definition of the Bottleneck number considers the \u2018dot product\u2019 of heat flux and temperature gradient vectors at any point per the following equation.<\/p>\n

    \"Bottleneck<\/p>\n

    The Bn is large when:<\/p>\n