SolidWorks 2014 includes new capabilities that let you define and store thermal properties of electronic components in CircuitWorks for reuse in SolidWorks Flow Simulation electronic cooling performance analyses. You can automatically utilize component properties defined in CircuitWorks™ in a fluid flow simulation, and choose which part properties to include with the analysis. This helps you validate electronics packaging more quickly and with less error.
See it in action below, and be sure to check out our new SolidWorks 2014 website to see everything else that’s new.
Posted by Matthew West in the SolidWorks Blog.
